UPSIREN PCM-2 8,5 W/mk grasa de silicona sólida cambio de fase almohadilla de silicona para GPU CPU portátil refrigeración 40x60mm almohadilla térmica de silicona

UPSIREN Phase Change Silicone Pad Sheet Laptop Phase Change Silicone Grease CPU Thermal Non -conductivity Paste Pad Patch

Main Features
0.04 Thermal Impedance
8.5 Thermal Conductivity
0.2 Thickness

Product Description

PCM-2 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost.

PCM-2, based on a novel polymer PCM system, exhibits excellent interface wetability during typical operating temperature ranges, resulting in extremely low surface contact resistance. Since PCM-2 comes only in 0.2mm (thicker versions are under development) you need to be sure that this thickness is compatible and suitable for the flatness of your package.

PCM-2 is a proprietary material that provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance ( 0.04˚Ccm2/W @ no shim), making the PCM-1 series desirable for high performance integrated circuit devices.

Product Use

Clamping pressure and temperature are suggested to achieve a minimum bond line thickness of the thermal interface material, typically less than 1.5 mil (0.038mm) for best performance.
The material must go through the phase change temperature to exhibit entitlement performance.
THERMAL IMPEDANCE POST RELIABILITY (ASTM E1461)
End of Line 0.04˚C-cm2/W
Bake 150˚C, 1000 h 0.04˚C-cm2/W
Double 85, 1000h 0.04˚C-cm2/W
Temperature Cycling ''B''(-55˚C to +125˚C, 1000 cycles) 0.045˚C-cm2/W