RGB
Color de hoja
Descripción
Features
1. Overall height 27mm
2. Double high efficiency heat pipe
3. Reflow soldering process
4. 8cm 4pin smart fan
Product parameter
Size: 93(L)×86.5(W)×27(H)
Weight: 195 g
Fan size: 8CM
Bearing type: ball bearing
Air volume: 12-32 CFM
Noise: 16-23 dBA±10%
Speed: 1,000 – 2,700 RPM±10%
Life: 50,000 hours
Support platform: Intel LGA775/1155/LGA1150/1156
Packing list: radiator × 1 back plate × 1 needle type thermal paste × 1
Blade Warrior
Thinner design, two 6mm copper heat pipes export heat from the CPU through the copper base, 8CM 4PIN fan, intelligent temperature control.
27mm thickness
The thickness of S85 is 27mm, which can meet the heat dissipation requirements of most HTPC, 1U servers and other platforms.
Double 6mm copper heat pipe
S85 is equipped with dual U-shaped 6mm copper heat pipes, which are in zero-distance contact with the cooling fins, and quickly conduct the heat generated by the CPU to the large-area fins, and then use the fan to take the heat out, effectively solving the heat dissipation problem in the narrow space of HTPC.
4PIN silent fan
The 8CM 4Pin intelligent temperature control mute module realizes effective control of the fan speed, making the fan run stably and silently.
Copper base
S85 adopts copper base and reflow soldering process, which improves the heat dissipation efficiency of S85
FIN process
The FIN process keeps each heat sink at an equal distance and is tightly fastened, effectively preventing air leakage on both sides, enhancing the firmness of the heat sink, improving the air duct, and making it more beautiful.
Simple transparent packaging
Transparent blister packaging, protect the product, beautiful and generous.
