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LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool

LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool
LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool - imagen 1
LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool - imagen 2
LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool - imagen 3
LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool - imagen 4
LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool - imagen 5
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Última actualización: 2026-01-29T23:47:39.490Z

Descripción

LUOWEI HS3Pro Motherboard Laminated Heating Platform Kit for IPhone X-16 Series Motherboard Laminated Heating Repair Tool

🔥 LUOWEI PRACTICA HS3/HS3-PRO Kit – Precision Tool for Flawless Mobile Phone Repairs 🔥

Upgrade your mobile repair toolkit with LUOWEI PRACTICA’s comprehensive heating & positioning system – designed for motherboard repair, component replacement, and precision soldering. Combining modular heating platforms, high-precision alignment modules, and expandable components, this kit delivers accuracy, efficiency, and long-term usability.

🌟 Core Components & Features:

  • Modular Heating Platform (HS3): Black durable platform, featuring a 260℃ temperature display and red heat-direction arrow. Equipped with a quick-install nozzle system (compatible with standard air guns) for uniform heating

  • High-Precision Alignment Module (HS3): Zero-error calibration, no wobble design ensures stable hole alignment during motherboard repair. Layered structure includes IP module (protection), heating plate (gentle warming), and heat insulation board (component safety)

  • Expandable Module Set: 6 stacked modules supporting IP X-16 and other series, enabling continuous upgrades. Each module fits specific motherboard models, reducing the need for multiple tools

  • 6 Positioning Plates (X-1 to X-6): Unique shapes matching different motherboard parts, ensuring stable placement during heating. Compact size (92×63×8mm per plate) for easy storage

  • Durable Build: Stainless steel and heat-resistant materials resist wear from high-temperature use. Total weight 383g (kit), lightweight for portability

  • Wide Application: Suitable for smartphones, tablets, and laptops – simplifies complex repairs like IC desoldering, component replacement, and motherboard maintenance.

💡 Why Choose LUOWEI PRACTICA?

We engineer tools for professionals – combining precision, modularity, and durability. Whether you’re a seasoned technician or a repair enthusiast, this kit elevates your work with unmatched accuracy and efficiency.

Get your LUOWEI PRACTICA HS3/HS3-PRO Kit today and master every mobile phone repair challenge!*



Visto en: Herramientas , Juegos de Herramientas , Sin categoría

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