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Descripción
AMD SP3 1U-P11 radiator (for 1U server)
Product model: AMD SP3 1U-P11
CPU type: AMD SP3 (rectangular motherboard)
Product size: 120mm*80mm*26mm
Fin thickness: 0.3mm
Fin spacing: 1.5mm
Number of copper tubes: 3
Power consumption: 205W
Material quality: copper base + aluminum fins + 3 heat pipes
3 composite pipes
Stronger thermal conductivity, better excellent thermal conductivity and heat dissipation performance
3 high-efficiency heat pipes closely cover the surface of the CPU, greatly increasing the contact area, allowing the heat to be conducted to the heat dissipation fins more efficiently.
Reflow soldering process
Better contact, stable thermal conductivity, high heat conversion rate, and efficient heat dissipation
Pure copper thermally conductive aluminum fin cooling module
The design of the conjoined heat dissipation group using pure aluminum material can directly dissipate part of the temperature, which greatly improves the heat dissipation efficiency.
Using copper inlaid bottom aluminum fin electroplating chemical nickel
Uniform thickness, corrosion resistance, wear resistance, excellent heat dissipation performance
Direct contact with the base for efficient heat dissipation
Direct contact connection allows rapid heat transfer to the fins for heat dissipation
Using 7762 thermal grease
Imported from Japan, high performance silicone grease
Pin parameters
